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        Optical
        Semiconductor Wafer
        Inspection System

        We have a full line-up of inspection systems for the semiconductor production process. All of these systems have earned an outstanding reputation on the production line for their high reliability, ease of operation and minimal running cost.

        Wafer Inspection System "INSPECTRA®" Series

        INSPECTRA? series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing.

        Luminescence Defect Inspection System "INSPECTRA® PL" Series for Mini?Micro LED

        Photoluminescence (PL) is used to automatically inspect for crystal defects, cracks, and luminescence defects which cannot be detected with visible light surface inspection.

        Luminescence Defect Inspection System "INSPECTRA® PL" Series for Power devices (GaN, SiC)

        Photoluminescence (PL) is used to automatically inspect for crystal defects, cracks, and luminescence defects which cannot be detected with visible light surface inspection.

        Wafer internal defect inspection system "INSPECTRA® IR" Series

        An infrared internal defect inspection system has been added to the INSPECTRA? series.It is now possible to inspection with both infrared and visual light in one system.

        Overlay measurement system "OM-7000H"

        Measures wafer bonding misalignment and top-to-bottom alignment to a high degree of precision.

        Review System "RV-3000"

        Reduces surface inspection device review time and contributes to greater inspection efficiency.

        Discontinued Products (Semiconductor inspection equipment)

        We ended support for the following model of Wafer Inspection Equipment “INSPECTRA”

        Inquiries

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