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        OF2000

        Super High Accuracy Flip Chip Bonder (for optical devices)

        OF2000

        Overview

        Super high accuracy flip chip bonders for miniature chips such as optical devices.
        Fully automatic machine equipped with tray-fed chip loader, as well as substrate loading and unloading functions.

        Features

        • "Unique Ceramic Heater Head" and "Fine Substrate Stage Leveling System," wide-range profile control is available.
          In addition, it can achieve excellent surface stability.
        • Through the vibration-proof design and environment temperature auto-calibration software, stable productivity and durability are maintained.
        • By adopting an "air bearing" in the bonding head, excellent low pressure bonding operation is achieved.

        Optional functions

        Anti-vibration device; bonding inspection unit, etc.

        Specifications for OF2000

        Substrate size(mm) 2–20 mm long x 2–20 mm wide (t=0.1–1.0 mm)
        Chip size(mm) 0.2–10 mm long x 0.2–10 mm wide (t=0.1–1.0 mm)
        Cycle time(*1) / Cycle time 15sec/chip substrate handing 15sec
        Alignment accuracy (3σ) ±0.5μm(X,Y) ±0.2°(0)(*2)
        Bonding force(N) 0.049-9.8
        Heat tool temperature(℃) RT-500 Ceramic heater
        Stage temperature(℃) RT-500 Ceramic heater

        NOTES
        *1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
        *2 Distance between makes is 200 μm

        Inquiries

        • CONTACT US
        • Tokyo office: +81-3-5962-9773

          Shiga office: +81-77-544-1892

        Technological Field
        Technology >> Encapsulation, bonding, flip chip > Flip Chip Bonders

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