<tbody id="ddimn"></tbody>
    <rp id="ddimn"></rp>

    <em id="ddimn"></em>
  1. <em id="ddimn"><acronym id="ddimn"><input id="ddimn"></input></acronym></em>
  2. <em id="ddimn"></em>
    1. <em id="ddimn"><strike id="ddimn"><u id="ddimn"></u></strike></em>
      <ol id="ddimn"></ol>

        <tbody id="ddimn"><p id="ddimn"></p></tbody>

        <button id="ddimn"></button>

      1. <button id="ddimn"><acronym id="ddimn"></acronym></button>
        Semiconductor Production Equipment

        Semiconductor Production Equipment

        As the semiconductor industry rapidly moves towards miniaturization and high-precision, we offer unique and leading edge solutions represented by our flip chip bonders.


        Flip Chip Bonders

        These are flip chip bonders used for the application of semiconductor packages.
        We can meet a wide range of needs, from R&D to mass production.
        Our lineup has a variety of bonders for TSV 3D mounting, FOWLP, optical devices, and other purposes.

        Laser Micro Trimming Equipment

        By laser irradiation, this equipment performs failure Mini LED removal, semiconductor memory repair, and resistance fuse trimming.

        earn jetblue points on american airlines,earn nursing degree online,play to earn games crypto,4cus earn money